Month: April 2025

How to eliminate vignetting/edge effects/charging effects

Creating a perfect image requires a combination of theoretical knowledge and practical experience and a balance between many factors. This process may encounter some challenging issues in the use of  Electron Microscope. Astigmatism is one of the most difficult corrections to make in an image and requires practice. The middle image in the following figure is a correctly focused image after astigmatism correction. The left and right images are examples of poor astigmatism correction, resulting in stretched stripes in the image. To achieve precise imaging, the cross-section of the Electron Beam (probe) should be circular when it reaches the specimen. The cross-section of…

Introduction to the Focused Ion Beam (FIB) Principle

Focused Ion Beam (FIB) is a microfabrication instrument that utilizes an electron lens to focus an ion beam into a very small size for precision cutting. Liquid Metal Ion Source The ion source is the heart of the FIB system, and the accurate focusing of the ion beam begins with the emergence of liquid metal ion sources. The ions generated by liquid metal ion sources, mostly utilizing gallium (Ga) as the metal material, have high brightness and petite source sizes. Liquid metal ion sources are formed by the field-induced ion emission from a liquid metal surface under a strong electric…

Choosing the Right EPR Spectrometer in Europe: A Comparative Analysis That Matters

Introduction to EPR Spectroscopy and Its European Market Electron Paramagnetic Resonance (EPR) spectroscopy plays a central role in analyzing materials with unpaired electrons—ranging from transition metal complexes to free radicals in biological systems. Europe has long been a powerhouse in magnetic resonance research, with universities and research institutions across Germany, France, the UK, and the Nordics leading innovation in this field. This high demand has fostered a sophisticated market for EPR spectrometers—both from traditional manufacturers and emerging players introducing new approaches to usability, integration, and pricing. Overview of Leading European EPR Spectrometer Manufacturers Europe is home to several key players in the EPR…

SEM Price Comparison in MEA Areas: Balancing Cost and Performance

Scanning Electron Microscopes (SEMs) are crucial for high-resolution imaging and material analysis, and in the Middle East and Africa (MEA) and the Far East, balancing cost and performance is key. The market spans a wide range—from premium systems to budget-friendly alternatives—and includes well-known brands like JEOL, FEI (Thermo Fisher Scientific), and Hitachi, as well as emerging names like CIQTEK. Diverse Price Tiers in the SEM Market High-End Systems: Top-tier models from established manufacturers such as JEOL and FEI typically range between USD 300,000 and USD 600,000. These SEMs are equipped with state-of-the-art electron optics, multiple detector arrays, and advanced automation features, making…

The Future of FE-SEM: Market Trends, Innovations, and Applications

Field Emission Scanning Electron Microscopy (FE-SEM) transforms scientific imaging with unparalleled precision, driving advancements in materials science, biomedical research, and nanotechnology. As industries demand higher resolution and accuracy, FE-SEM is emerging as the go-to tool for cutting-edge research. Market Growth and Forecast The FE-SEM market is experiencing significant growth, particularly as industries like nanotechnology, semiconductor manufacturing, and battery development push the need for more precise imaging. Increasing investments in research and development and advanced technologies ensure that demand continues to grow. This trend will continue in the coming years, making FE-SEM an important tool for cross-disciplinary research. CIQTEK is actively contributing…

CIQTEK FIB SHOW: Dual-Beam Electron Microscope Facilitates 28mm Chip Process Analysis

Based on the Dual-beam Electron Microscope DB550 independently controlled by CIQTEK, the Transmission Electron Microscope (TEM) nanoscale sample preparation of 28nm process node chips was successfully achieved. TEM verification can clearly analyze the key dimensions of each structure, providing a domestic precision detection solution for semiconductor process defect analysis and yield improvement.